Sybase IQ 12.7 ESD #3 includes new features in the areas of large object (LOB) support, operational management, ease of use, and performance.
INSERT...LOCATION now supports retrieving large object data (LOB) up to 20MB in length from a remote database.
See “INSERT...LOCATION supports 20MB large object (LOB) data [CR 453439]”.
WORD (WD) indexes are now supported on LONG VARCHAR character large object (CLOB) columns. The CONTAINS predicate is also supported on LONG VARCHAR (CLOB) columns with a WORD (WD) index.
See “WORD index and CONTAINS predicate support for character large object (CLOB) columns [CR 415547]”.
String search functions for LONG VARCHAR (CLOB) and LONG BINARY (BLOB) data are now supported.
See “String search functions for large object columns [CR 415543]”.
Support of the LIKE predicate on LONG VARCHAR (CLOB) columns is now included.
See “LIKE predicate for character large object (CLOB) columns [CR 415546]”.
The LOCK TABLE statement supports acquiring WRITE locks on a set of tables. The LOCK TABLE statement also allows enqueuing for READ, WRITE, and EXCLUSIVE locks for a specified time period.
See “LOCK TABLE support [CR 480880, CR 472791, CR 463196, 444921]”.
Authorized users can now display query plans in the Java-based Interactive SQL (dbisql) plan window. You can also save and print query plans from dbisql, instead of accessing the .iqmsg file or query plan files on the server.
See “Using query plans with Interactive SQL for Java [338070]”.
Workload monitoring enhancements provide a mechanism to analyze a workload to determine the tables/columns/indexes in use, so that unused objects can be dropped to save space, improve DML performance, and decrease backup time.
The login auditing feature, present in previous ESDs, lets you log connection details for a given user in the transaction log file. A new example added to documentation shows how to use the auditing feature to examine attempts to access unauthorized information.
The IQ Network Client is now certified on the Windows Vista operating system.
See “Product summary”.
